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HANBIT PRECISION INDUSTRIAL CO., LTD. |
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The picture on the left side is that of just produced body parts of semiconductors that are widely used in computer and other appliances. Generally, the products are divided into for-transistor, IC and LOC, and the current market is in transition to high-performance and small-size LOC, thus LOC is being more emphasized. This L/F undergoes A/E attach, wire bonding, trimming, forming, molding and final testing.
The picture on the right side is that of a die press. Among high-precision characteristics, die-related parts are assembled and controlled up to the accuracy of 1~2 , and since the production trend of L/F is now small-in-size, more accurate and sophisticated technology is required. Generally, 50~100 tone of weight is used for pressing, and all the die-pressed products must undergo plating, taping, down set and out off.
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contact ;
add. 59, Palyong-Dong, Charyong Danji 2-29-6, Changwon-City, Kyungsangnam-Do, Korea
call : +82-551-299-7101~5, fax : +82-551-251-0961
e-mail : gongdan@city.changwon.kyongnam.kr